From Düsseldorf to Las Vegas, the world’s leading machine builders are showcasing how smart connectivity transforms manufacturing. Recent trade shows have spotlighted our OEM partners’ innovations — powered by ei³ technology — that turn data into intelligence and connectivity into competitive advantage.
At the world’s largest plastics and rubber industry event, two ei³ partners — Coperion and Shibaura Machine — took center stage with digital platforms built on ei³’s secure IIoT foundation.
Coperion impressed visitors with C-BEYOND, its connected solution that helps customers boost efficiency and uptime through real-time data insights. Built on ei³’s platform, C-BEYOND delivers scalable digital intelligence that supports smarter production and continuous improvement.
Photo: Coperion and ei³ teams at K Show
Shibaura Machine demonstrated its machiNetCloud platform — empowering manufacturers with predictive analytics, seamless connectivity, and measurable ROI. Their booth also introduced LEO, an innovative AI advisor designed to support smarter machine operation and faster decision-making.
Photo: Shibaura Machine booth at K Show
Across the Atlantic, Pack Expo brought together the packaging world — and ei³’s ecosystem was on full display.
Following a successful connectivity launch, GREIF-VELOX announced a new partnership with ei³ to bring AI-based preventive maintenance and connected service capabilities to the powder packaging industry. By combining world-class mechanical engineering with digital intelligence, GREIF-VELOX is enhancing uptime, sustainability, and customer service across its global operations.
Photo: Sebastian Pohl of GREIF-VELOX with Spencer Cramer at ei³ launch event, Pack Expo
At Pack Expo, ei³’s J. Adam Griffen joined OMAC for The Amazing Packaging Race — an initiative that teaches students how open automation standards enable digital transformation. The event underscored ei³’s ongoing commitment to education and collaboration across the packaging ecosystem.
Photo: Adam Griffen with student teams at the OMAC booth
At the intersection of printing, packaging, and automation, Norwalt presented Norwalt Nexus — its next-generation connectivity platform powered by ei³. The system integrates real-time production analytics with secure remote service, enabling faster support and deeper performance insights across automated packaging lines.
Photo: Norwalt booth at Printing United Expo