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From Düsseldorf to Las Vegas, the world’s leading machine builders are showcasing how smart connectivity transforms manufacturing. Recent trade shows have spotlighted our OEM partners’ innovations — powered by ei³ technology — that turn data into intelligence and connectivity into competitive advantage.
K Show – Düsseldorf, Germany
At the world’s largest plastics and rubber industry event, two ei³ partners — Coperion and Shibaura Machine — took center stage with digital platforms built on ei³’s secure IIoT foundation.
Coperion | C-BEYOND: Data Insights for More Productivity
Coperion impressed visitors with C-BEYOND, its connected solution that helps customers boost efficiency and uptime through real-time data insights. Built on ei³’s platform, C-BEYOND delivers scalable digital intelligence that supports smarter production and continuous improvement.
Photo: Coperion and ei³ teams at K Show
Shibaura Machine | machiNetCloud: Built-In BrAIn for Smart Manufacturing
Shibaura Machine demonstrated its machiNetCloud platform — empowering manufacturers with predictive analytics, seamless connectivity, and measurable ROI. Their booth also introduced LEO, an innovative AI advisor designed to support smarter machine operation and faster decision-making.
Photo: Shibaura Machine booth at K Show
Pack Expo – Las Vegas, USA
Across the Atlantic, Pack Expo brought together the packaging world — and ei³’s ecosystem was on full display.
GREIF-VELOX | AI-Driven Service Intelligence
Following a successful connectivity launch, GREIF-VELOX announced a new partnership with ei³ to bring AI-based preventive maintenance and connected service capabilities to the powder packaging industry. By combining world-class mechanical engineering with digital intelligence, GREIF-VELOX is enhancing uptime, sustainability, and customer service across its global operations.
Photo: Sebastian Pohl of GREIF-VELOX with Spencer Cramer at ei³ launch event, Pack Expo
OMAC Collaboration | Inspiring the Next Generation
At Pack Expo, ei³’s J. Adam Griffen joined OMAC for The Amazing Packaging Race — an initiative that teaches students how open automation standards enable digital transformation. The event underscored ei³’s ongoing commitment to education and collaboration across the packaging ecosystem.
Photo: Adam Griffen with student teams at the OMAC booth
Printing United Expo – Orlando, USA
Norwalt | Smart Automation Meets Connectivity
At the intersection of printing, packaging, and automation, Norwalt presented Norwalt Nexus — its next-generation connectivity platform powered by ei³. The system integrates real-time production analytics with secure remote service, enabling faster support and deeper performance insights across automated packaging lines.
Photo: Norwalt booth at Printing United Expo
Connected Innovation Across the Globe From Europe’s plastics halls to America’s packaging floors, ei³ partners are proving how connected intelligence elevates machine performance, service, and sustainability. As these OEMs innovate for the future, ei³ remains proud to power the secure IIoT foundation that makes their digital transformation possible.
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